Quality Control

Checks on production procedure

（1）Checks on the films
＊ An eye inspection has to be done on the after-developed films.
＊ The main items inspected include broken trace, short, trace thinness, symmetry, and scratches on the films.
＊ After inspection, the films must be protected in a plastic bag.
（2）Checks on the after-exposed inner layers（no need of inspection on the double-layer board）
＊ After the inner layer dry-ink is exposed, an eye inspection has to be done.
＊ The main items inspected include broken trace, short, foreign inclusions, symmetry, and damage.
（3）Checks on the after-etched inner layers（no need of inspection on the double-layer board）
＊ After the inner layer dry-ink is exposed, an eye inspection has to be done.
＊ The main items inspected include broken trace, short, scratches, discolorations, bulges, foreign inclusions, peeling, residual copper, and cutting.
（4）Checks on after copper-plating
＊ An eye inspection has to be done after copper-plating.
＊ The main items inspected include any voids, and blocked holes.
（5）Checks on the after-exposed outer layer
＊ After the inner layer dry-ink is exposed, an eye inspection has to be done.
＊ The main items inspected include broken trace, short, foreign inclusions, symmetry, and scratches.
（6）Checks on the after-etched outer layers
＊ An eye inspection has to be done after etching.
＊ The main items inspected include broken trace, short, any scratches, discolorations, bulges, foreign inclusions, peeling, residual copper, and cutting.
（7）Checks on delivery
＊ An eye inspection has to be done after the board is finished.
＊ After inspection, the boards must be packaged according to the part numbers.

Items Inspected before Delivery

＊The final inspection includes checks on the exterior and exterior size .
The items inspected include：

（1）Board quality, thickness, dimension, and quantity of orders, etc.
（2）No bulges on the board surface.
（3）No other conductors unless agreed upon by customers.
（4）No copper shown, swollen, peeling, etc.
（5）No breaks on the board of tab & route.
（6）No other substance sticked on the board.
（7）No legend or solder mask are allowed to drip into the holes of the components.
（8）Unreadable legend marks are not allowed.
（9）No slitting and cutting. Any slitting, cutting and breaking on a board thickness of 1/2 is acceptable if it doesn’t affect the loop.
（10）Damage, discoloring, scratching, deformations on the PAD shall not affect the exterior appearance.
（11）No appearance shall be affected if the printing positions of the solder mask slope to cover the pad, or the damaged parts of solder mask discolor.
（12）No board discolorations or crazing are allowed to affect the appearance.
（13）Any single measling is acceptable. But, it shall not enlarge after heated. Any sequential measlings are unacceptable.
（14）The foreign inclusions within 0.5mm is acceptable if it doesn’t concern the circuitry. But, no dirty substance is allowed on the board to affect the appearance.